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Thermal Conductivity 0.085 Hollow Microspheres Reduce Mechanical Stress Improve

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Thermal Conductivity 0.085 Hollow Microspheres Reduce Mechanical Stress Improve

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Thermal Conductivity 0.085 Hollow Microspheres Reduce Mechanical Stress Improve

High-Density Hollow Microspheres with True Density 0.244-0.256 Dielectric Constant 1.2-2.2 (100MHZ) and Density 0.15-1.0 Product Description: Hollow Microspheres are high-porosity, light weight ...

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Hollow Microspheres Improve flameproof

      

Thermal Conductivity 0.085 Hollow Microspheres

      

Hollow Microspheres Reduce Mechanical Stress

      
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